Semiconductor
Plasma and CVD Process Monitoring
Plasma Etch, Chemical Vapor Deposition (CVD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD) applications require a thorough understanding of the complex chemistries involved in the processes. Also critical to the processes is the ability to monitor low-level components.
For plasma applications, scientists choose Extrel MAX and MAX-LT Flange Mounted Mass Spectrometers. These detection systems offer high performance and speed with the capability to perform energy analysis. High sensitivity and high abundance sensitivity enables monitoring of very low partial pressure components within a high background. Ions, radicals, and neutrals can be measured as well. Extrel's Plasma Analysis System can work with processes up to atmospheric pressure.
Extrels MAX Product Line for Plasma Etch, CVD and PECVD Process Monitoring includes:
- Axial Energy Analyzer
- Cross Beam Deflector Ionizer
- MAX Flange Mounted Mass Spectrometers - (GP-110)
- MAX-LT Flange Mounted Mass Spectrometers - (GP-112)
- Plasma Analysis/Molecular Beam Systems - (GP-101)
The MAX and MAX-LT Flange Mounted Mass Spectrometers feature:
- High Sensitivity to 6 mA/Torr
- High Resolution to 110 M at m/z 28
- High Abundance Sensitivity to 107
- Partial Pressure Detectability to 10-16 mbar
- Energy Resolution down to 0.5eV
- Various Mass Ranges from 1-60 and 2-1000 amu
- Axial and right angle configurations
- Positive and Negative Ion, and Neutral Detection
For more information related to Plasma CVD and Process Monitoring see the following:
- Analysis of Fast Neutrals in Plasma - (GA-305)
- Appearance Potentials - (GA-630)
- Molecular Beam for Pre-formed Ions - (GA-301)
- Tandem Axial Ionizer/Energy Filter for Internal and External Ions - (GA-510)
- Using Quadrupoles with High Voltage Ion Sources - (SA-550)
For additional specifications and benefits of the Extrel MAX and MAX-LT Systems and available Components, please view our product guide or contact your local Sales Representative.